Advanced Materials Area
- Advanced PCB Material Using Nano-composite as Filler
- An Advanced Thermal Material for Metal-Core Printed Circuit Board (MCPCB)
- Cost effective, high efficiency heat dissipation PCB for high-brightness LED
- Development of Nano-solder for Low temperature Pb-free Electronic Interconnect Application Using a Modified Polyol Process
Advanced Manufacturing Technology
- Development of Chelating Ion-Exchange Resin Technology for Electroplating
- Laser Direct Patterning of Graphene on Hard Substrates for Nano-electronic Fabrication
- Development of Manufacturing Technology of Optical Printed Circuit Board
- Development of organic and Printed Electronics manufacturing technology for high volume production
- Development of the Liquid Crystal Polymer Printed Circuit Board Manufacturing Technology for High-speed Application
- Development and Commercialization of Ceramic-based Printed Circuit Boards
- Development of Molded Interconnect Device Manufacturing Technology Using 3D Laser Activation of Doped Thermoplastics on 3D Printed Objects
- Laser Polishing of 3D Printed Metal Objects with Inner Structures
Microvia Drilling and Laser Dicing
- Electronics Packing Miniaturization
- High Density Interconnect (HDI) Technologies in PCB and electronic manufacture
Microvia Metallisation and Electroplating
Environmental
Rigid Flex Manufacturing
Automotive Related Research
- Automotive Sub-System Design Guideline